Publication
“If you can't explain it simply, you don't understand it well enough”
Books & Book Chapters
Dzung V.Dao, (Guest Editor), Special Issue on BioSensors, BioElectronics, BioMedicalDevices, BioMEMS/NEMS and Applications 2016, Sensors and Materials,Vold. 29, No. 12 2017, MYU K.K., Tokyo, Japan.
Dzung V.Dao, Robert J. Howlett, Rossi Setchi, Ljubo Vlacic (Editors), SustainableDesign and Manufacturing 2018, Springer Nature, Switzerland,(11/2018) Link
KoichiNakamura,Dzung V. Dao, Yoshitada Isono, Toshiyuki Toriyama, Susumu Sugiyama, “Nanowires”, Chapter15: "Electronic States and Piezoresistivity in SiliconNanowires", pp. 297-314, In-Tech, Vienna, Austria. ISBN:978-953-7619-79-4, 2010.
H.-P.Phan, D. V. Dao, and N.-T. Nguyen, "Silicon Micro/Nanomachining andApplications", Chapter 9, Micro and Nanomachining, Springer,2017.
T. Dinh,N.T. Nguyen, Dzung V. Dao, "Thermoelectrical Effect in SiCfor High-Temperature MEMS Sensors", Springer Nature, Switzerland (9/2018)
T. Dinh, T.Nguyen, H.-P. Phan, V. Dau, D.V. Dao, N.-T. Nguyen, Chapter 2: PhysicalSensors: Thermal Sensors, Encyclopedia of Sensors and Biosensors, Elsevier,2021, DOI
Sang Tran, Dzung Dao, “Sensing applications of non-layered 2D materials”. InIH Abidi (Ed.), Semiconductors and Semimetals, 2023, vol.113, pp. 217-251, Elsevier. [DOI: 10.1016/bs.semsem.2023.10.007]
C. T.Nguyen, K. T. Nguyen, T. Dinh, V. T. Dau, Dzung V. Dao, WearablePhysical Sensors for Non-Invasive Health Monitoring, In K. Mitsubayashi(Ed.), Wearable Biosensing in Medicine and Healthcare, 2024,Springer.