Publication
“If you can't explain it simply, you don't understand it well enough”
Journal Papers
H.-P. Phan, Karen M. Dowling, T.-K. Nguyen, T. Dinh, D.G. Senesky, T. Namazu, D.V. Dao, and N.-T. Nguyen, "Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure", Materials & Design, 156, pp.16-21, 2018. (IF: 4.364) Link
V. Balakrishnan, T. Dinh, H.-P. Phan, D.V. Dao, and N.-T. Nguyen, "Highly Sensitive 3C-SiC on glass based thermal flow sensor realized using MEMS technology", Sensors & Actuators A: Physical, 279, pp.293-305, 2018. (IF: 2.499) Link
K. R. Sreejith, C. H. Ooi, D. V. Dao and N.-T. Nguyen, "Evaporation dynamics of liquid marbles at elevated temperatures", RSC Advances, 8(28), pp.15436-15443, 2018. (IF: 3.108) Link
F. R. Munas, G. Melroy, C. B. Abeynayake, H. L. Chathuranga, R. Amarasinghe, P. Kumarage, V. T. Dau, D. V. Dao, "Development of PZT Actuated Valveless Micropump", Sensors, 18(5), p.1302, 2018. (IF: 2.677) Link
J. Jin, C. H. Ooi, D. V. Dao and N.-T. Nguyen, "Liquid marble coalescence via vertical collision", Soft Matter, 14(20), pp.4160-4168, 2018. (IF: 3.889) Link
A.R. Md. Foisal, H.-P. Phan, T. Dinh, T.-K. Nguyen, N.-T. Nguyen, and D.V. Dao, "A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding", RSC Advances, 8(28), pp.15310-15314, 2018. (IF: 3.048) Link
T. Dinh, H.-P. Phan,T.-K. Nguyen, V. Balakrishnan, H. Cheng, L. Hold, I. Iacopi, N.-T. Nguyen, andD.V. Dao,"Unintentionally doped epitaxial 3C-SiC(111) nanothin film as material for highly sensitive thermal sensors at high temperatures", IEEE Electron Device Letters, 39(4), pp.580-583, 2018. (IF: 3.048) Link
A. Vatani, P. Woodfield, N.T. Nguyen, Dzung V. Dao, "Onset of thermomagnetic convection around a vertically oriented hot-wire in ferrofluid",Journal of Magnetism and Magnetic Materials, 456, pp.300-306, 2018. (IF: 2.630) Link
T. Dinh, T.-K. Nguyen, H.-P. Phan,F.-W. Jarred, C. D. Tran, N.-T. Nguyen, and D.V. Dao,"Electrical resistance of carbon nanotube yarns under compressive transverse pressure", IEEE Electron Device Letters, 39(4), pp.584-587, 2018. (IF: 3.048) Link
T.-K. Nguyen, H.-P. Phan, J, Han, T. Dinh, A. R. M. Foisal, S. Dimitrijev, Y. Zhu, N.-T. Nguyen, and D.V. Dao,"Highly sensitive p-type 4H-SiC Van der Pauw sensor", RSC Advances, 8(6), pp.3009-3013, 2018. (IF: 3.108) Link